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Paul Scherrer Institut PSI Materials Group

Paul Scherrer Institut
5232 Villigen PSI, Schweiz/Switzerland
Tel. +41 56 310 21 11
Fax. +41 56 310 21 99



Updated:
26.08.2009
E-Mail: thomas.lippert@psi.ch


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Instrumentation
(click on links to see photos)

Laser, Excimer Lamps, Reactive Ion Etching, Thin Film Deposition, Sample Preparation, Analysis

Laser  
 
ArF excimer laser (Lambda Physik LPX 300) with 600 mJ/pulse at 193 nm.  
 
KrF excimer laser (Lambda Physik LPX 300) with 800 mJ/pulse at 248 nm.  
 
KrF excimer laser (Lambda Physik LPX 100) with 400 mJ/pulse at 248 nm.  
 
XeCl excimer laser (Lambda Physik COMPex) with 400 mJ/pulse at 308 nm.  
 
Nd:YAG laser (Quantel Brilliant B) with 850 mJ/pulse at 1064 nm, 400 mJ/pulse at 532 nm, 160 mJ/pulse at 355 nm and 90 mJ/pulse at 266 nm.  
 
Ar+ laser (Coherent Innova 300C FreD), multi line, including UV (doubling of 488 nm) with 0.1 W at 244 nm.  
 
Ti:Sapphire (Coherent 899 Ring Laser for Raman), 680-1100 nm (line widths < 2 GHz)  
 
CO2 laser, tunable, CW or pulsed (40 W).  
 
 
Excimer lamps (setup)  
 
Xe2* at 172 nm  
 
KrCl* at 222 nm  
 
XeCl* at 308 nm  
 
 
Reactive Ion Etching (RIE, Alcatel GIR 3000)  
   
Processes possible with up to 8 different corrosive or non-corrosive gases (see chamber with Ar plasma).  
   
Sample size up to 6 inches (15.3 cm) diameter.  
   
600 W rf power at 13.56 MHz.  
   
Butterfly-valve-controlled pressure range from 5 to 100 mTorr (6.5 * 10-3 to 1.3 * 10-1 mbar).  
   
Added ICP generator to increase plasma density.  
 
 
Thin Film Deposition  
 
1.
High vacuum (HV) chamber for pulsed laser deposition with a variety of options  
   
One cylindrical target  
   
Synchronized reactive gas pulse (University Zurich designed and built)  
   
Quartz micro balance  
   
Plasma beam (designed and built at the National Institute for Lasers, Plasma and Radiation Physics, NILPRP, Romania)  
   
Ion (Langmuir) probe  
   
Infrared camera  
 
2.
Ultra high vacuum (UHV) chamber for pulsed laser deposition with a variety of options  
   
5 computer controlled cylindrical targets (PSI designed and built)  
   
Optional: 1 computer controlled pellet target (PSI designed and built) for RT and 77K  
   
Computer controlled substrate manipulator with x,y,z and 2 rotational movements for temperatures from 120 K to 1100 K (desigend and build by Prevac)  
   
Substrate holder for heating and cooling applicable for pulsed laser deposition (desigend and build by Prevac) for T up to 1100 K and pressure up to 1 bar (oxygen)  
   
Quartz micro balance (mechanical design from Prevac, Oscillator, PLO-10i from BeamTec-MaxTec)  
   
Synchronized reactive gas pulse (University Zurich designed and built)  
   
Plasma beam (designed and built at the National Institute for Lasers, Plasma and Radiation Physics, (NILPRP), Romania and modfied for UHV at PSI)  
   
Ion-probe (distance and angle resolved) (PSI designed and built, probe built at Risoe National Institute, Denmark)  
   
Meta-stable detector (distance and angle resolved) (PSI designed and built)  
   
Plasma mass spectrometer (energy, distance and angle resolved)(EQP-from Hiden) also utilized for SIMS  
   
Ion gun for in-situ SIMS analysis (IG 20 from Hiden)  
   
Load-lock system with battery pumped transfer vessel (from Prevac)  
 
3.
Vacuum chamber for laser induced forward transfer with a variety of options  
   
Computer controlled substrate manipulator (x,y)  
   
Vacuum to ambient pressure for various gases  
   
Optical access perpendicular and along the laser axis.  
 
4.
MO-CVD (metal-organic chemical vapor deposition, under construction, PSI)  
 
 
Sample preparation  
 
Diamond wire saw (Logitech Model 15)  
 
Precision polishing/lapping (Unipol 801, MTI Corporation)  
 
Spin coater with dispenser (SCS P6708)  
 
Draw blade applicator for film master blading  
 
High speed mixing (Ika, Ultra-Turrax T25)  
 

 
Analysis
 
 
1.
Techniques for analysis after irradiation  
   
Profilometer (Veeco, Dektak 8) for measurements of surface profiles and roughness.  
   
Scanning electron and standard optical (video) microscopies  
   
Raman-microscopy (imaging, Jobin Yvon): with a highest spatial resolution of 1 micron3. Sample heating up to 1200 K under inert gas is also possible.  
   
High resolution Raman spectroscopy: possible for different laser lines (Ar+ laser + RingLaser, see above) and measurements close to the Raleigh line ~ 5-10 cm-1) and temperatures from 4 K to 300 K.  
   
X-ray diffraction (XRD, Siemens D500) for standard theta-2theta and small angle.  
   
Laser-ablation induced emission (breakdown) spectroscopy (or LIBS) for plasma analysis of the samples (including trace analysis).  
   
Dynamic and static SIMS (Hiden EQS) with argon and oxygen ions. Best lateral resolution 100 microns; depth profiling and compositional analysis.  
   
Quartz micro balances for measurement of ablation or deposition rates.  
   
UV/Vis/near-IR Spectrometer (Varian Cary 500) to measure diffuse reflectance (Labsphere, DRA-CA-50) and transmission  
   
Hall measurement system (Ecopia HMS 3000) at RT and 77 K with 0.5 Tesla.  
 
2.
Time-resolved (ns to ms) analytical techniques  
   
Gated-ICCD with monochromator for emission spectroscopy (time and space resolved) of products after laser irradiation  
   
Shadowgraphy for dynamic observation of the gas phase above the sample after laser irradiation  
   
Surface interferometry for dynamic changes of the sample surface morphology after laser irradiation  
   
Ion probes (Langmuir probes) for plasma analysis (time, space and angle resolved)  
   
Time-, space-, angle-, and energy resolved plasma mass spectrometry  
 
3.
Other analytical techniques available in our group and the General Energy Research Department  
   
DRIFT, FT-Raman, quadrupole mass spectrometry, Auger-spectroscopy, X-ray photoelectron spectroscopy (XPS), contact angle, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), atomic force microscopy (AFM), spectroscopic ellipsometry, and many other techniques available in a large research institute.